Термопаста Thermaltake TG-60 heat sink compound Thermal paste 52 W/m·K 1 g

TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of<br>52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.<br><br><b>High Thermal Conductivity</b><br>With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.<br><br><b>Even Better Cooling Performance</b><br>We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.<br><br><b>All-In-One Application Kit</b><br>TG-60 Liquid Metal Compound has an application kit, which includes a set of tools for immediate use.Thermaltake TG-60. Type: Thermal paste, Thermal conductivity: 52 W/m·K, Product colour: Black. Weight: 1 g. Quantity per pack: 1 pc(s)