Термопаста Thermaltake TG-30 heat sink compound Thermal paste 4.5 W/m·K

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.<br><br><b>High Thermal Conductivity</b><br>The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.<br><br><b>Easy to Apply</b><br>Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.<br><br><b>All-In-One Application Kit</b><br>This thermal compound application kit includes a set of easily-applied tools for immediate use.<br><br><b>Sustainability and Safety</b><br>The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.<br>Non-electrical conductive compound ensures better safety measures for you and your system.Thermaltake TG-30. Type: Thermal paste, Thermal conductivity: 4.5 W/m·K, Product colour: Black. Quantity per pack: 1 pc(s)