Termopasta Genesis Silicon 851 heat sink compound 13.4 W/m·K

<b>SILICON 851</b><br><br>Genesis Silicon 851 is an extremely efficient thermal paste that will meet high expectations of users looking for uncompromising solutions.<br><br><b>THERMAL CONDUCTIVITY= 13,4W/m•K</b><br>Very high thermal conductivity will allow use of full potential that cooler provides.<br><br><b>CONVINIENT SIZE</b><br>Silicon 851 is enclosed, convenient-size syringe, which holds 0,5g/0,2ml thermal greaseGENESIS Silicon 851. Thermal conductivity: 13.4 W/m·K, Density: 2.5 g/cm³, Constitutive ingredients: Silicone. Volume: 0.2 ml. Quantity per pack: 1 pc(s), Package type: Blister