GELID Solutions TP-GP04-R-C heat sink compound Thermal pad

The GP-Ultimate 120×20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition, and the ultimate 15W/mK thermal conductivity, the GP-Ultimate 120×20 offers the best performance in class.<br><br>The GP-Ultimate 120×20 is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60°C to 220°C. It features seamless application and has the thermal pad dimensions of 120x20mm to best fit enlarged surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.Gelid Solutions TP-GP04-R-C. Type: Thermal pad, Density: 3.2 g/cm³. Width: 120 mm, Depth: 20 mm, Height: 1.5 mm. Quantity per pack: 1 pc(s)