Iceberg THERMAL FUZEIce Plus heat sink compound Thermal paste 13 W/m·K 3.5 g

<b>Low Temperature with High Thermal Conductivity</b><br>Evenly spread layers of thermal paste with a high thermal conductivity of 13 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition.<br><br><b>No Spatula? No Problem!</b><br>Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind. Making it simple to apply with less mess.<br><br><b>Superior Operational Temperature</b><br>FUZEIce™ Plus can handle up to 200°C and last for years!<br><br><b>There’s no paste like FUZEIce™ Plus</b><br>No Fuss, No Muss, No ProblemIceberg Thermal FUZEIce Plus. Type: Thermal paste, Thermal conductivity: 13 W/m·K, Density: 2.6 g/cm³. Weight: 3.5 g. Quantity per pack: 1 pc(s)